Sensor package fabrication via additive manufacturing for automotive sector

sensor package

Sensor package fabrication via additive manufacturing for automotive sector- An introduction to the TINKER project by Leo Schranzhofer, Project Manager / Research Scientist, Profactor GmbH, at ONLINE 3D Printing Electronics Conference (21 January 2021, 15:00 – 19:00 CET). REGISTER HERE to attend the conference

This H2020 project, coordinated by Leo Schranzhofer, PROFACTOR, started at 01.10.2020. Notion Systems and PV nanocell are partners in the consortium and will be mentioned in the talk.

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CMOS based SPAD Arrays and SiPMs for the next LIDAR generation

Jakub Stein-Cichoszewski

by Jakub Stein-Cichoszewski, Elmos Semiconductor AG

LIDAR is one of the enabling sensor technology for advanced driver assistance system (ADAS), autonomous driving and mobile robotics. Therefore, we developed LIDAR dedicated Single-Photon Avalanche Diode (SPAD) arrays and Silicon Photomultiplier (SiPM) arrays, which are manufactured within our own automotive qualified 0.35µm CMOS technology.

A 16×256 pixels SPAD Array with integrated time-to-digital converter (TDC) enables laser ranging with a maximal range of 192 m and a resolution of 4.68 cm, respectively. For efficient background light rejection each macro-pixel uses four vertically arranged single SPADs based on the detection of temporal correlated photons. Very high SPAD fill factor for better photon management results from relocation of both coincidence and TDC circuits into the sensor’s periphery.

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